Ultra-small lapping and polishing machine

The unit is designed specifically for short production runs in micro component manufacture - for example, for the premium quality watch industry, nano wafer polishing, technical ceramic washers and MEMS devices. It has a component envelope of 55 mm diameter, with 18 mm maximum thickness. The Engis 432 can be used to lap and polish very thin (down to 50 microns) components, to an extremely high degree of smoothness, in materials including copper, beryllium, stainless steel and sapphire, as used in watch manufacture for ultra-thin springs and gears, as well as most precision optics materials, including sapphire, GaN and SiC. The small scale of the lapping surface offers a significant benefit in lapping and polishing very small, ultra-thin components that would be impossible on larger dual face machines. As few as three components can be double side lapped simultaneously. The machine allows for processing on one piece of equipment and can be operated in unmanned mode, either 'timed' or 'thickness controlled' if required, while still maintaining its accuracy and repeatability.