Tungaloy Corporation's DoPent series of extremely rigid face milling cutters feature a novel insert inclination designed to reduce cutting forces while improving cycle times.
The Tungaloy developed DoPent range incorporates a double sided pentagonal insert and owes its rigidity to a clamping system that provides a large contact area between the cutter body and the insert. This reduces chatter and aids surface finish quality, tool life and productivity.
DoPent are available as a shank type cutter as well as a face mill with a coarse, close or extra close pitch body for high feed machining. The extra close pitch SS-Fit system is particularly valuable when maximum material removal is required.
The shank type cutter body is available in 32, 40, 50, 63 and 80 mm diameters with three to seven insert pockets depending upon the diameter selected. The bore type cutter is available in diameters that include 50, 63, 80, 100, 125 and 160 mm. The coarse pitch cutter body offers 3 to 7 insert seats, the close pitch cutter has 4 to 10 seats while the extra close pitch cutter has 6 to 20 insert pockets depending upon diameter selected.
The versatile DoPent Series can machine low and high carbon steels, alloy and tool steels, stainless steel, grey and ductile cast iron as well as aluminium and aluminium alloys. To meet a broad spectrum of applications in the aerospace, automotive, mould and die, medical and general manufacturing sectors, Tungaloy has created suitable inserts for each material type. These include AH725, AH120, AH140, T3130, T1115 and TH10 insert grades.
Additionally, the numerous insert grades have been developed with Tungaloy's MJ geometry for general machining of steel, stainless and cast irons and provide a balance of edge sharpness and strength that prevents edge chipping. A complementary W wiper geometry is available for enhanced surface finishes on steel and cast iron.
The W geometry Wiper insert and the AJ geometry are for aluminium alloy machining. The AJ geometry provides a lapped insert face for reduced adhesion and improved chip evacuation to improve material removal rates.