The expanded Sendai Plant Campus in Kagoshima will meet increasing demand for semiconductor packages powering ADAS, sensor cameras, 5G and more.
Kyocera Corporation President Hideo Tanimoto announced a plan to build the largest manufacturing facility it has ever operated in Japan, expanding production capacity for components including organic semiconductor packages and crystal device packages.
Construction is scheduled to begin this month at the company’s Sendai Plant Campus in Kagoshima. it is part of an investment of approximately 62.5 billion yen ($488m).
Three converging factors are creating strong demand for Kyocera’s organic semiconductor packages and crystal device packages. Smart vehicles are expanding the need for automotive cameras and high-performance processors used in Advanced Driver-Assistance Systems (ADAS) and autonomous driving.
New communications infrastructures, including fifth-generation (5G) base stations and datacenters, are being deployed worldwide. In addition, the rising trend toward digitalization is expanding demand for electronic products ranging from personal computers and smartphones to consumer goods, industrial automation, and others.
Kyocera will open the new facility in October 2023 to serve these growing trends, aiming for a 4.5-fold increase in production capacity for organic packages at the Sendai Plant Campus, as well as a substantial increase in capacity for crystal device packages.
Kyocera said it will contribute to the community by stimulating economic development in Kagoshima, creating new employment opportunities through expanded production of semiconductor components in response to global demand.
