These machines have been designed to grind advanced materials to a high degree of precision in flatness and surface quality, greatly reducing or even eliminating the need for subsequent lapping, moving direct from grinding to final polish of SiC and other materials.Ideal applications for the EVG Series machines include, semiconductor wafer grinding or back-thinning (SiC, GaAs, Sapphire, Si, GaN, AIN, InP), semiconductor equipment components, for example ceramic chucks, glass ceramic, as well as substrates for semiconductor advanced packaging, including MEMS (ceramic, polyimide).

Engis EVG machines are available in three different models, the EVG-200, EVG-250 and EVG-300, all of which incorporate a programmable logic controller, 400 rpm max. worktable speed and 2000 rpm max. wheel speed

Sizes of the machines vary from 800 x 800 x 1900 for the EVG-200 up to 1050 x 1050 x 2020 for the EVG-300. All machines have been designed with ergonomics in mind, with easy access to the work area and with a variety of chuck options.

Advanced machine control options are available, providing automated grinding wheel dressing, automated positioning of the grinding wheel relative to the workpiece and workpiece thickness measurement. For maximum control, an upgrade to in-process thickness measurement with feedback to the grinding cycle in real time is also available.

The most advanced model offers automated thickness options: multi-point contact probing for multiple wafer grinding or a choice of contact or non-contact continuous in-process measurement for single wafer machining.

EVG Series machines are equipped with Engis grinding wheels based on the Mixed Abrasive Diamond (MAD) Wheel technology, which tailors the wheel to the material being processed.A video showing the machine at work is can be seen at www.engis.com/videos.

Engis specialists application engineers can provide specific process recommendations for particular materials and applications.