Laser profiler for small parts

ES Technology’s new ES-CUT150 system has been designed around the wide range of metals typically used in the production of medical device components including stainless steels, titanium, aluminium, gold, silver and brass.

Capable of cutting material up to 5.0 mm thick, the 150 Watt Pulsed YAG Laser can be configured to produce a kerf width of only 18µm, enabling high precision cutting and profiling with minimal burr formation.

The material to be processed is manipulated under the fixed laser optics by a Baldor brushless - servo driven X-Y table, which has a 400 by 400 mm work envelope. With an accuracy of +/-10 µm and speeds of up to 35.0 mm/second the system can cut and profile high quality components at high speeds.

A micrometer adjustment facility allows the processing head to be set to the optimum height for the material thickness being cut at the time, and appropriate air assist gasses can be introduced via attachments to the processing head. Additional options such as a honeycomb mounting base and extraction unit, are also available to remove any fine dust created during cutting.

Author
Andrew Allcock

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ES Technology Ltd

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