30 March 2010
Lapping and polishing machine with small footprint from Engis UK
The Engis 432 lapping machine has compact dimensions of 430 mm by 660 mm by 890 mm, which allow it to handle components up to 55 mm diameter and thickness of 18 mm. The lapping machine can lap and polish to a thickness of just 50 microns.
The machine is particularly suited for materials including copper, beryllium, stainless steel and sapphire, as used in watch manufacture for ultra-thin springs and gears, as well as, most precision optics materials, including sapphire, GaN and SiC.
The 4-way, double-sided lapping and polishing machine, is designed specifically for short production runs in micro component manufacture, for example for the premium quality watch industry, nano wafer polishing, technical ceramic washers and MEMS devices.
The machine allows for processing on one piece of equipment and can be operated in unmanned mode, either timed or thickness controlled if required, while still maintaining its accuracy and repeatability.
The small scale of the lapping surface offers a significant benefit in lapping and polishing very small, ultra-thin components that would be impossible on larger dual face machines. As few as three components can be double side lapped simultaneously.
Author
Michael Richards
This material is protected by Findlay Media copyright
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the
sales team.
Supporting Information
Related Companies
Engis (UK) Ltd