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18/11/2009
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New processes are said to hold out the promise of cost-effective production of micro-components in both low and high volumes.
 Laser Evolved Micromachining (LEM) is a new term coined by sub-contractor Precision Micro to describe the combination of laser technology's ultra precision capabilities with the scale of economies offered by advanced electroforming and photo etching.
There are two processes. The first is Laser Evolved Etching Process (LEEP). This incorporates laser technology in the precision etching process. Using Laser Direct Imaging (LDI), this supports the manufacture of micro-components, with both fine features and high complexity, to tolerances measured in microns.
The technology removes the need for traditional phototools and streamlines the manufacturing operation, says the company. It is now possible to create micro channels in the 25 micron range and to achieve a 4-fold improvement in pitch accuracy across an 800 by 600 mm sheet.
Laser Evolved Electroforming (LEEF) is the second process. Photo-electroforming is effective in cases of extreme tolerances, complexity or light weight. Parts have superior edge definition and a near optical finish, with features defined by a photographically produced pattern on the substrate. By direct imaging the pattern on the substrate (using LDI) far tighter tolerances can be maintained, with features of less than 15 micron achieved to high repeatability and with excellent process control.
LEEF supports higher levels of complexity at tighter tolerances and delivers finer features than could ever have been achieved by conventional photo-electroforming, without the use of prohibitively expensive glass master tooling.
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Author
Andrew Allcock
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