An ultra-small footprint four-way, double-sided lapping and polishing machine, designed specifically for research applications and short production runs in precision optic and small component manufacture is available from Engis.
The Engis 432 is extremely flexible and - using Engis diamond processing products - can be used to lap most precision optics and advanced materials, including sapphire, GaN and SiC. The machine can be operated in unmanned mode, either timed or thickness controlled if required, while still maintaining its accuracy and repeatability.
Despite its compact size, the small machine has a component envelope of 55 mm diameter, with 18 mm maximum thickness, making it capable of producing a wide range of precision components. At the same time, the small scale of the lapping surface creates a significant benefit in enabling the machine to lap and polish ultra-thin pieces that would be impossible on larger dual face machines.
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